Posted: 2 Min ReadFeature Stories

Broadcom’s Innovation on Display at the OCP Global Summit 2022

Commitment to the Open-Source Community and the Value of OCP

Broadcom is proud to be both a sponsor and participant in this year’s OCP Global Summit 2022. The theme of the summit - “Empowering Open,” speaks directly to our commitment to innovation and continued investment in R&D and the open source community. For decades, Broadcom has focused on cutting-edge networking, infrastructure, broadband, and connectivity solutions that move data around the world.

These are fundamental to helping the world’s great innovators to keep innovating; they enable infrastructure and cloud applications, power enterprise wired and wireless networks, and bring multi-gigabit broadband to your home and the palm of your hands.

Open standards are responsible for driving innovations critical to growing the future of AI/ML and hyperscale cloud computing. Our broad, innovative portfolio exemplifies our significant contributions to open standards and commitment to the open-source community. As a result, the world’s most successful companies rely on our infrastructure technologies, of which open source plays an important role. At this year’s OCP, many of these efforts will be on display including:

  • As one of the industry’s largest contributors to SAI and the SONiC network operating systems, Broadcom is contributing specifications for features enabling AI/ML deployments to the community. Having a strong commitment to networking, Broadcom recently introduced the Tomahawk 5 Ethernet switch. Critical to enabling efficient use of the massively shared infrastructure in large data centers, Tomahawk 5 provides AI/ML workload virtualization with features such as single-pass VxLAN routing and bridging. The entire Tomahawk family supports SAI and SONiC network operating systems.
  • Broadcom has long supported the Open Compute Project, and continues to invest in areas of importance to OCP, most recently with its launch of the industry’s first open end-to-end networking solution optimized for Remote Direct Memory Access (RDMA) over converged Ethernet (RoCE). In addition, we continue to highlight our PCIe switches, Ethernet network adapters, and SAS/SATA/NVMe storage solutions that address challenges providers face in hyperscale and enterprise data centers.
  • Our Physical Layer Products will be well represented in a variety of contexts showcasing a portfolio of high-performance devices for data center, cloud, and AI networks. The introduction of our industry-first 5nm 1.6T MACSec/IPSec PHY extends our contribution to PAI use cases and further exemplifies Broadcom’s continued contribution to open-source, cross-platform systems.
  • We are presenting a demo of the new Co-Packaged Optics (CPO) technology that showcases how our new optics network chip dramatically addresses next generation bandwidth and power challenges. It offers further proof of how Broadcom, the open-source community, and our mutual customers around the globe benefit from our open collaboration. The demo will take place at our partner Ragile Networks booth.

Throughout the summit, Broadcom will be showcasing a host of technologies across OCP main tent keynotes, partner presentations, demos and numerous technical break-out sessions. You can find a full list of our 19 speaking sessions and panels here.

We are pleased to be a part of the open-source community and an active participant and supporter of OCP, helping to enable the future of technology.

About the Author

Charlie Kawwas, Ph.D.

President, Semiconductor Solutions Group, Broadcom

Charlie Kawwas is President of the Semiconductor Solutions Group at Broadcom, overseeing the company’s global operations, as well as sales for the Semiconductor and Brocade Storage Networking businesses and corporate marketing for all of Broadcom.

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